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All-in-One ACF System

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SKU: Status: Out of stock

Introducing the All-in-One ACF System - Revolutionizing ACF Processing.

Prepare to experience a game-changing solution in the world of Anisotropic Conductive Film (ACF) processing. Our "All-in-One ACF System" is engineered to streamline the ACF assembly process with unprecedented efficiency and convenience. By combining laminating, aligning, and bonding functions into a single machine, this innovative system is a breakthrough for R&D, small-scale production, and any setting where space-saving and cost-effectiveness are paramount.

Triple Functions, One Machine: The All-in-One ACF System combines lamination, alignment, and bonding processes into a single, space-saving unit, simplifying the ACF assembly workflow.

Versatile and Cost-Effective: Ideal for R&D purposes and small-scale production, this system optimizes both time and cost, reducing the need for multiple machines.

Enhanced Space Efficiency: Say goodbye to cumbersome, multi-machine setups; our system maximizes space utilization, making it suitable for compact workspaces.

Precision and Accuracy: Ensure the highest level of ACF assembly precision and quality with the All-in-One system, enhancing the reliability of your output.

Streamlined Workflow: Minimize downtime and eliminate the need for manual transfers between processes, enhancing overall efficiency and productivity.

Model VLB2S2H-1510
  Laminator Bonder
Heating method Constant Heat Constant Heat (can be upgraded to Ceramic ActiveHeat™)
Heat tool size Maximum 60mm ACF lamination length.
Maximum 10mm ACF lamination width.
Length: 5-100mm
Width: 1-8mm
Size and weight WxDxH & Approximately 250Kg
Utilities Power: AC220V ±10%, Single Phase 
Frequency: 50/60Hz  
Input Air: CDA (10mm OD tube) 
Input Air Pressure Range: 0.4-0.6MPa 
Process Control Systems  Controller: Mitsubishi PLC 
User Interface: Mitsubishi Touch Panel 
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