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Introducing ACF Precision Aligner: Your Precision Solution for ACF Laminate Mounting.
In today's dynamic landscape of electronics manufacturing, precision is the linchpin that holds the industry together. The MountPro ACF PrecisionAlignerTM emerges as a pivotal component within the ACF Vstar semi-production line, dedicated to delivering precision ACF Laminate mounting with unwavering accuracy. This innovative equipment is tailored for seamless integration into universal systems, setting new standards for industries, particularly in the realm of electrical systems.
Independent Operation: The ACF Precision Aligner is capable of working independently, streamlining tasks without the need for constant manual oversight.
Upgradability: This machine can be upgraded to suit various applications, such as automatic laser marking, visual inspection, data reading, automatic screw tightening, automatic dispensing, and automatic soldering, welding, and staking. Its adaptability ensures that it aligns with the evolving needs of your manufacturing processes.
Modular Component Integration: The ACF PrecisionAligner offers modular component integration. You can easily add various heads, manipulators, valves, drivers, or other end effectors to your existing ACF equipment. This modularity ensures that your equipment is tailored to specific applications, making it a highly adaptable and versatile solution.
Seamless Third-Party Integration: The machine seamlessly interacts with third-party systems, both mechanically and electrically. This capability expands your manufacturing capabilities, allowing you to incorporate additional equipment and technologies from various sources effortlessly. This integration simplifies the incorporation of additional equipment and boosts overall efficiency in your manufacturing processes.
| Model | VA-3030 |
| Mounting Accuracy * | (FOB) X: ±15μm/3σ ; Y: ±15μm/3σ |
| (COG) X: ±5μm/3σ ; Y: ±5μm/3σ | |
| Minimum detectable fiducial size | φ60 (μm) |
| Field of View | 2.7 x 3.6mm |
| Heating Method | Constant Heat (Ambient to 200°C ) |
| Bonding Force Range | 6 to 55 (N) |
| Heat Tool Size | 30(L) x 10(W)mm |
| Stage XY Motion & Head Z Motion | Servo Motor |
| Head θ Motions | Step Motor |
| Device Tray Supply Type | Automatic |
| Device Tray Size | W200 x D250 x 3 (mm) |
| Tray Supply | Stack Tray(Max 20 trays) |
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